|New QFN packages from Barry Industries||July 12, 2012|
The US company Barry Industries in cooperation with Semiconductor Enclosures developed and let out a new line of hermetic QFN packages. This line contains two packages with the sizes of 3×3 mm, two packages with the sizes of 5×5 mm and one package with the sizes of 7×7 mm. Packages are made of high-temperature co-fired ceramic. They are intended for a wide range of working frequencies and are characterized by small losses and low thermal resistance.
In new packages gold and nickel are applied at formation of the metallized coverings.
The Barry Industries company manufactures the wide list of high-frequency resistors, terminations and attenuators developed for average power from 0.05 to 1500 W. To meet the needs of customers various materials and metallization techniques are used when manufacturing of components.